Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing led package, and led package manufactured thereby

ABSTRACT

There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

TECHNICAL FIELD

The present invention relates to a phosphor film, a method ofmanufacturing the same, a coating method of coating a light emittingdiode (LED) chip with a phosphor layer, a method of manufacturing alight emitting device package, and a light emitting device packagemanufactured thereby.

BACKGROUND ART

A light emitting diode (LED), known as a next generation light source,has many positive attributes such as a relatively long lifespan, lowpower consumption, a rapid response rate, environmentally friendlycharacteristics, and the like, as compared with a light source accordingto the related art, and has been used as an important light source invarious products such as illumination devices and back light units fordisplay devices. In particular, Group III nitride-based LEDs includingGaN, AlGaN, InGaN, InAlGaN, and the like have been used in semiconductorlight emitting devices outputting blue or ultraviolet light.

In general, a reflective layer is formed under an LED chip and light isemitted upwardly and from four sides thereof, that is, the front, therear, left and right of the LED chip, and therefore, when a lightemission color is changed using a phosphor material, it may be animportant issue to coat an upper surface of a chip and four sidesthereof with a phosphor material to have a uniform thickness in order tosecure a uniform quality of light. Thus, various conformal LED chipcoating techniques have been proposed, but since a majority of thetechniques are applied prior to a wire bonding process, the applicationthereof are limited to a flip-chip type package or an additional processis required to open a separate wire bonding pad part during phosphorcoating. Further, such a technique is used in a free mold leadframe-type packaging process and may be difficult to be applied to acase in which a phosphor is coated with respect to individual chips.

As a packaging method in which a phosphor is coated after a bondingprocess is completed, there is a dispensing process in which phosphorparticles are dispersed in a resin having high heat resistance and lighttransmission to produce a paste phase and a minute amount thereof isejected through a nozzle having a predetermined diameter to then coatthe entire chip with phosphors. In this process there is a need toappropriately maintain a viscosity adjusted between phosphor particlesand a resin in order to eject an appropriate amount of micro liquiddroplets. Here, a solid phase of inorganic phosphor particles havepartial sedimentation during a coating process, even after beingdispensed, until a phosphor paste is cured, due to a relatively lowviscosity being required for implementation of the coating process,within a tube storing matters in equipment, and therefore,dispersibility of phosphor particles may be deteriorated in a resin, andlight scattering may be increased.

DISCLOSURE Technical Problem

An aspect of the present invention provides a phosphor film having astructure in which a phosphor layer can be coated to have a uniformthickness, a method of manufacturing the same, coating a light emittingchip with a phosphor layer by using the phosphor film, a method ofmanufacturing a light emitting device package, and a light emittingdevice package manufactured thereby.

Technical Solution

According to an aspect of the present invention, there is provided aphosphor film including: a base film; a phosphor layer formed on thebase film and obtained by mixing phosphor particles in a partially curedresin material; and a cover film formed on the phosphor layer to protectthe phosphor layer.

The phosphor layer may be in a partially cured state at normaltemperature and may have a phase change to be movable upon being heated.

The phosphor layer may have a modulus value between 100 Mpa or higherand 500 Mpa or less in a temperature range of 0° C. to 25° C. and mayhave a modulus value between 0.5 Mpa or higher and 3 Mpa or less in atemperature range of 60° C. to 80° C.

In the phosphor layer, the modulus value at 80° C. may, have a value of10% or less of the modulus value at 25° C.

The base film may be formed of an expandable polymer material, forexample, a polyolefin material.

The phosphor layer and the cover film may include a temporary adhesivelayer formed therebetween.

The phosphor layer may be configured of a plurality of phosphor stripsspaced apart from one another by a predetermined interval, and the coverfilm may be formed of a plurality of cover film strips having a sizecorresponding to that of the plurality of phosphor strips.

The phosphor layer may further include a spacer having a predeterminedthickness and formed of a light transmissive material, and the spacermay have a surface coated with a reflective layer.

According to another aspect of the present invention, there is provideda method of manufacturing a phosphor film, the method including:preparing a base film; and forming a phosphor layer on the base film,the phosphor layer being formed of a material obtained by mixingphosphor particles in a partially cured resin material and configured ofa plurality of phosphor strips spaced apart from one another by apredetermined interval.

The forming of the phosphor layer may include: forming a thin film onthe base film, the thin film being obtained by mixing the phosphorparticles in the partially cured resin material; forming a cover film onthe thin film; forming a cutting line along which the thin film and thecover film are cut into strips having a predetermined size; andexpanding the base film such that the thin film and the cover film areseparated along the cutting line.

The forming of the cutting line may include forming a plurality of firstcutting lines on the thin film and the cover film to be in line in asingle direction; and cutting the thin film, the cover film and the basefilm along a second cutting line perpendicular to the first cutting lineto have a strip form.

The forming of the phosphor layer may include: forming the thin film onthe base film, the thin film being obtained by mixing the phosphorparticles in the partially cured resin material; forming a plurality ofthe first cutting lines on the thin film to be in line in a singledirection; expanding the base film such that the thin film is dividedinto a plurality of regions along the first cutting line; forming thecover film on the thin film; and cutting the cover film, the thin filmand the base film along the second cutting line perpendicular to thefirst cutting line to have a strip form.

The forming of the phosphor layer may include: disposing a mask on thebase film, the mask including a plurality of holes having a sizecorresponding to that of the plurality of phosphor strips; forming thethin film by printing the material obtained by mixing the phosphorparticles in the partially cured resin material on the base film, byusing the mask; and forming the cover film on the thin film.

According to another aspect of the present invention, there is provideda method of coating a light emitting device with a phosphor material,the method including: preparing a phosphor film including a phosphorlayer formed of a material obtained by mixing phosphor particles in apartially cured resin material; and coating with the phosphor layer byapplying heat to the phosphor layer to have mobility generated therebyand by pressing and adhering the phosphor layer having the generatedmobility to the vicinity of the light emitting device.

The phosphor film may include a base film having the phosphor layerformed therein and a cover film protecting the phosphor layer, thephosphor layer may be divided into a plurality of phosphor strips cut tohave a size corresponding to the light emitting device, and the coverfilm may be divided into a plurality of cover film strips cut, togetherwith cutting of the phosphor layer, to have a size corresponding to thelight emitting devices.

The coating of the phosphor layer may include: lifting one phosphorstrip and one cover film strip from the base film; disposing the liftedphosphor strip and cover film strip such that the phosphor strip facesthe light emitting device; and applying heat to the lifted phosphorstrip, and pressing and adhering the phosphor strip having the generatedmobility to the vicinity of the light emitting device.

The method may further include emitting ultraviolet light to reduceadhesive force between the base film and the phosphor strip.

The coating of the phosphor layer may include: separating the cover filmfrom the phosphor film; disposing the phosphor film from which the coverfilm has been lifted, such that one of the plurality of phosphor stripsfaces the emitting light device; and separating the phosphor strip fromthe base film by applying pressure to a surface different from a surfaceof the base film on which the phosphor strip is disposed, and pressingand adhering the phosphor strip having the generated mobility to thevicinity of the light emitting device by applying heat to the phosphorstrip.

The method may further include emitting ultraviolet light to reduce theadhesive force between the base film and the phosphor layer.

The light emitting device may be configured in plural, and respectivephosphor strips among the plurality of phosphor strips may besequentially coated in the vicinity of the plurality of light emittingdevices while applying pressure through a roller to a surface differentfrom a surface of the base film on which the plurality of phosphorstrips are disposed.

The light emitting device may be configured in plural, and the pluralityof phosphor strips may be coated in the vicinity of the plurality oflight emitting devices while concurrently applying pressure to theplurality of phosphor strips to the different surface from the surfaceof the base film on which the plurality of phosphor strips are disposed.

According to another aspect of the present invention, there is provideda method of manufacturing a light emitting device package, the methodincluding: preparing a base film and a phosphor film including aphosphor layer obtained by mixing phosphor particles in a partiallycured resin material on the base film; preparing at least one lightemitting device and disposing the phosphor film on an upper part of thelight emitting device so as to allow the phosphor layer to face thelight emitting device; and applying heat to the phosphor layer to havemobility generated thereby and coating at least portions of an uppersurface and sides of the light emitting device with the phosphor layerby allowing the phosphor layer having the generated mobility to flowtoward a surface of the light emitting device. The phosphor film mayfurther include a cover film protecting the phosphor layer, the phosphorlayer may be divided into a plurality of phosphor strips cut to have asize corresponding to the light emitting device, and the cover film maybe divided into a plurality of cover film strips cut, together withcutting of the phosphor layer, to have a size corresponding to the lightemitting devices.

The coating of the phosphor layer may include: lifting one phosphorstrip and one cover film strip from the base film; disposing the liftedphosphor strip and cover film strip such that the phosphor strip facesthe light emitting device; and applying heat to the lifted phosphorstrip to have mobility generated thereby and coating a surface of thelight emitting device by allowing the phosphor strip having thegenerated mobility to be separated from the cover film strip and flowtoward the surface of the light emitting device.

The coating of the phosphor layer may include: forming a receiving holein the phosphor layer in a position corresponding to a position of atleast one electrode of the light emitting device including the at leastone electrode; adhering the phosphor film to an upper part of the lightemitting device, in a structure in which the phosphor layer faces thelight emitting device such that the electrode of the light emittingdevice is received within the receiving hole; and exposing the electrodeby lifting the base film and performing a coating process by applyingheat to the phosphor layer to have mobility generated thereby so as toallow the phosphor layer having the generated mobility to flow along asurface of the plurality of light emitting devices.

The light emitting device may be arrayed in plural, the phosphor layermay include a plurality of receiving holes to respectively correspond topositions of the electrodes of the respective light emitting devices,and the plurality of light emitting devices may be coated by beingintegrally covered.

The phosphor layer may be in a partially cured state at normaltemperature and may have a phase change to be movable upon being heated.

The phosphor layer may have a modulus value between 100 Mpa or higherand 500 Mpa or less in a temperature range of 0° C. to 25° C., and amodulus value between 0.5 Mpa or higher and 3 Mpa or less in atemperature range of 60° C. to 80° C.

In the phosphor layer, the modulus value at 80° C. may have a value of10% or less of the modulus value at 25° C.

The light emitting device may include at least one electrode formed onan upper surface thereof to be electrically connected to a wire, and thephosphor layer may be coated along a shape of the wire to have a shapecorresponding to that of the wire.

The light emitting device may include an LED chip having a semiconductorlayer and an active layer, and the phosphor layer may cover at least oneside of the active layer in sides of the light emitting device.

According to another aspect of the present invention, there is provideda light emitting device package including: at least one light emittingdevice; a phosphor layer formed of a material obtained by mixingphosphor particles in a partially cured resin material and covering atleast portions of an upper surface and sides of the light emittingdevice; and a main body part having the light emitting device mountedtherein and electrically connected to an electrode included in the lightemitting device, wherein the phosphor layer is in a partially curedstate at normal temperature and has a phase change to be movable uponbeing heated.

The phosphor layer may have a modulus value between 100 Mpa or higherand 500 Mpa or less in a temperature range of 0° C. to 25° C., and amodulus value between 0.5 Mpa or higher and 3 Mpa or less in atemperature range of 60° C. to 80° C.

In the phosphor layer, the modulus value at 80° C. may have a value of10% or less of the modulus value at 25° C.

The light emitting device may be wire-bonded to the electrode providedwith an upper surface thereof through at least one wire, and thephosphor layer may be coated along a shape of the wire to have a shapecorresponding to that of the wire.

The light emitting device may be wire-bonded to the electrode providedwith the upper surface thereof through the at least one wire, and thephosphor layer may cover the upper surface and the sides of the lightemitting device, excepting the electrode.

The light emitting device may include an LED chip having a semiconductorlayer and an active layer, and the phosphor layer may cover at least oneside of the active layer in sides of the light emitting device.

The light emitting device package may further include an encapsulatingpart formed above the main body part and covering the light emittingdevice to protect the light emitting device including the phosphorlayer.

Advantageous Effects

As set forth above, in a phosphor film according to an embodiment of thepresent invention, a phosphor layer may be configured to have propertiesin which it is in a partially cured state and a modulus is reduced uponbeing heated, such that the phosphor layer can be coated to have auniform thickness around a light emitting chip. In particular, even in acase in which a wire-bonded light emitting chip is coated, the coatingof a phosphor layer may be obtained without transformation of a wire.

In a method of manufacturing a phosphor film, a method of coating alight emitting diode (LED) chip with a phosphor layer, a method ofmanufacturing an LED package, and an LED package manufactured thereby: aphosphor film may be manufactured to have a form in which the phosphorlayer can be easily coated on the LED chip; and a phosphor layer may becoated to have a uniform thickness around various types of LED chips byusing the same, whereby a light emitting device having excellent qualityof light may be manufactured.

DESCRIPTION OF DRAWINGS

The above and other aspects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 illustrates a structure of a phosphor film according to anembodiment of the present invention;

FIGS. 2A through 2C schematically illustrate a structure of a phosphorlayer in the phosphor film of FIG. 1;

FIGS. 3 and 4 illustrate a structure according to variation examples ofthe phosphor film of FIG. 1;

FIG. 5 illustrates a structure of a phosphor film according to anotherembodiment of the present invention;

FIG. 6 illustrates an example in which the phosphor film of FIG. 5 isstored;

FIG. 7 illustrates a structure of a phosphor film according to anotherembodiment of the present invention;

FIG. 8 illustrates a structure of a phosphor film according to anotherembodiment of the present invention;

FIGS. 9 and 10 schematically illustrate a structure of a phosphor filmaccording to another embodiment of the present invention;

FIGS. 11 to 15 illustrate a method of manufacturing a phosphor filmaccording to an embodiment of the present invention;

FIGS. 16 to 22 illustrate a method of manufacturing a phosphor filmaccording to another embodiment of the present invention;

FIGS. 23 to 27 illustrate a method of manufacturing a phosphor filmaccording to another embodiment of the present invention;

FIGS. 28A and 28B illustrate a method of manufacturing a phosphor filmaccording to another embodiment of the present invention;

FIGS. 29 to 32 illustrate a method of coating a light emitting devicewith a phosphor layer according to an embodiment of the presentinvention;

FIGS. 33A and 33B schematically illustrate a structure of a pickup headused in the embodiment of FIGS. 29 to 32 by way of example;

FIG. 34 illustrates a method of coating a light emitting device with aphosphor layer according to another embodiment of the present invention;

FIGS. 35A and 35B illustrate a method of coating a light emitting devicewith a phosphor layer according to another embodiment of the presentinvention;

FIGS. 36A and 36B illustrate a method of coating a light emitting devicewith a phosphor layer according to another embodiment of the presentinvention;

FIGS. 37A, 37B and 37C illustrate a method of coating a light emittingdevice with a phosphor layer according to another embodiment of thepresent invention;

FIGS. 38A and 38B schematically illustrate a method of manufacturing alight emitting device package according to another embodiment of thepresent invention, and a light emitting device package manufacturedthereby;

FIGS. 39 to 43 schematically illustrate a method of manufacturing alight emitting device package according to another embodiment of thepresent invention; and

FIG. 44 schematically illustrates a light emitting device packagemanufactured through the method of FIGS. 39 to 43.

MODE FOR INVENTION

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. The invention may,however, be embodied in many different forms and should not be construedas being limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the invention to thoseskilled in the art.

In the drawings, the shapes and dimensions of elements may beexaggerated for clarity, and the same reference numerals will be usedthroughout to designate the same or like elements.

FIG. 1 illustrates a structure of a phosphor film according to anembodiment of the present invention. FIGS. 2A through 2C schematicallyillustrate a structure of a phosphor layer in the phosphor film ofFIG. 1. FIGS. 3 and 4 illustrate a structure according to variationexamples of the phosphor film of FIG. 1.

With reference to FIGS. 1 to 4, a phosphor film 100 according to anembodiment of the present invention may include a base film 110, aphosphor layer 130 formed on the base film 110, and a cover film 150protecting the phosphor layer 130. The phosphor film 100 may furtherinclude a temporary adhesive layer 120 formed between the base film 110and the phosphor layer 130.

The base film 110 may be provided to serve as a carrier of the phosphorlayer 130. As a material of the base film 110, a general polymermaterial such as PVC, Polyolefin, PET, PI, or the like, may be used. Inaddition, the base film 110 may be formed of an expandable material, andin this case, for example, polyolefin may be used. In a case in whichheat resistance is required, a PI-based polymer material may be used.

The temporary adhesive layer 120 may be provided to easily reduceadhesive force when, for example, the phosphor layer 130 is firstadhered to the base film 110 while maintaining the adhesive forcetherebetween and then the phosphor layer 130 needs to be separated fromthe base film 110 in order to coat a light emitting diode (LED) chipwith the phosphor layer 130 at the time of a packaging process. Thetemporary adhesive layer 120 may be selectively applied as needed,according to a process, and may not necessarily be required. Thetemporary adhesive layer 120 may be formed of a material havingproperties that it initially has adhesive properties but loses theadhesive properties when a constituent material is cured by heat orultraviolet (UV) in a subsequent process. As a material of the temporaryadhesive layer 120, a material obtained by mixing, for example, apolymer-based resin and an ultraviolet curable polymer, may be used, andin this case, the adhesive force may be reduced by the irradiation ofultraviolet light. As an ultraviolet curable polymer, an acrylic-basedresin or the like may be used. The temporary adhesive layer 120 may havea thickness in a range of several pm to several tens of μm.

The phosphor layer 130 may be formed of a material obtained by mixingphosphor particles in a partially cured resin material. For example,phosphor particles 132 may be mixed in a polymer binder 135 including aresin, a curing agent, a curing catalyst and the like, such that apartially cured (B-stage cured) compound material may be obtained. Inthe phosphor particles 132, a garnet-based phosphor of YAG, TAG andLuAG, a silicate-based phosphor, a nitride-based phosphor, asulfide-based phosphor, an oxide-based phosphor, or the like, may beused, which may be configured as a mono phosphor or a poly-phosphormixed in a predetermined ratio. A resin used in the phosphor layer 130may be a resin material satisfying conditions of high adhesion, highlight transmission, high heat resistance, a high light refractive index,moisture resistance, and the like, and silicon, an epoxy-based orinorganic polymer, may generally be used. In order to secure relativelyhigh adhesion, an additive for improving adhesion, for example, asilane-based material may be used. The phosphor layer 130 may be coatedon the base film 110 in a liquid state and may be then subjected to adrying and partial curing process such that a layer having a solid stateis obtained therefrom at a normal temperature. When heat is applied tothe phosphor layer 130 in a partially cured state, a phase change mayoccur such that the phosphor layer may have a state of a movable extent.This state change may be usefully applied in an LED packaging process tobe described below. The phosphor layer 130 may be coated on an object tobe required and remaining curing may be then performed throughsubsequent additional curing such that a completely cured solidstructure may be obtained. In order to perform the process describedabove, the phosphor layer 130 may have a modulus value of about 100 Mpaor higher at normal temperature and may have a modulus value of about 20MPa or less at about 65° C. or more. In more detail, in the phosphorlayer, a modulus value in a temperature range of 0° C. to 25° C. may bebetween about 100 Mpa or higher and about 500 Mpa or less, and a modulusvalue in a temperature range of 60° C. to 80° C. may be between about0.5 Mpa or higher and about 3 Mpa or less. More specifically, in thephosphor layer 130, the modulus value at about 80° C. may have a valueof 10% or less of the modulus value at about 25° C. An appropriatemodulus value may be determined according to an object through which thephosphor layer 130 having occurrence of mobility is to penetrate, forexample, a thickness or rigidity of a wire of a wire-bonded LED chip. Ingeneral, a case in which an amount of modulus change based on a changein temperature is relatively great may be used in the process. Physicalproperties as described above may improve cutting performance when thereis a need to cut the phosphor layer 130 in a predetermined standard inadvance at the time of manufacturing the phosphor film 100. In addition,at relatively high temperature at the time of a packaging process, thephysical properties as described above may provide a condition thattransformation of a wire does not occur even in a case of, for example,pressing a wire-bonded LED chip from an upper part thereof. In order tosecure the physical properties described above, a resin material may beobtained by mixing a thermoplastic resin in a thermosetting resin or asilicon resin.

FIG. 2 schematically illustrates a structure of the phosphor layer 130in the phosphor film 100. The phosphor layer 130 may be formed of asingle layer as shown in FIG. 1 and formed of a plurality of layersstacked therein as shown in FIG. 2. In detail, the phosphor layer 130may have a stacked structure in which a first layer 130 a is formed onthe base film 110 and a second layer 130 b is formed on the first layer130 a. Although the present embodiment provides a case in which thephosphor layer has two stacked layers, three or more layers may beincluded in the phosphor layer. Respective layers 130 a and 130 b may beobtained by mixing phosphor particles in partially cured resin materials135 a and 135 b. Here, resin materials of respective layers may havedifferent properties. For example, the resin material 135 a forming thefirst layer 130 a may have greater strength than the resin material 135b forming the second layer 130 b, such that the phosphor layer 130 ismaintained to have a stable form. In addition, the resin material 135 bforming the second layer 130 b may have higher adhesive force than theresin material 135 a forming the first layer 130 a, such that adhesionto a light emitting device 20 may be easily performed.

Any one of the first and second layers may be formed of a transparentlayer. In detail, as shown in FIG. 2B, the first layer may be formed ofa transparent layer that does not contain the phosphor particles 132,and the second layer may only contain the phosphor particles 132. Inaddition, as shown in FIG. 2C, the first layer 130 a may only containthe phosphor particles 132, while the second layer 130 b may not containthe phosphor particles 132.

Meanwhile, the phosphor layer 130 may include a receiving hole 136receiving an electrode 21 of the light emitting device 20 wire-bonded toa wire as shown in FIGS. 3 and 4. The receiving hole 136 may be formedto have a structure in which it penetrates the phosphor layer 130 so asto correspond a position and a structure of the electrode 21 of thelight emitting device 20. Therefore, even in a case in which thephosphor layer 130 is located on the light emitting device 20 at thetime of a packaging process, the electrode 21 of the light emittingdevice 20 may be received in the receiving hole 136 such that theelectrode 21 is not covered with the phosphor layer 130 but is exposedto the outside. Then, the electrode 21 may be stably bonded to the wire,and thus, at the time of a packaging process, transformation of the wiremay be prevented. That is, the structure of the phosphor layer 130 shownin FIG. 1 may be differentiated from that of the phosphor layer 130shown in FIGS. 3 and 4 in that in FIG. 1, the coating is performed bypressing the wire-bonded light emitting device 20 together with thewire, while in FIGS. 3 and 4, the wire bonding process is performed in astate in which the light emitting device 20 is only coated. As shown inFIGS. 1 to 4, in the case in which the phosphor layer 130 includes thereceiving hole 136 formed therein, the base film 110 may have a throughhole 111 formed to correspond to the receiving hole 136, to thus providea structure in which the phosphor film 100′ is overall penetratedthereby. Although the case in which a single electrode 21 is formed onthe light emitting device 20 is described with reference to theaccompanying drawings, the present invention is not limited thereto.That is, in the electrode structure as described above, a plurality ofelectrodes may be applied thereto, and in this case, the receiving hole136 may be provided in plural to correspond to the plurality ofelectrodes. The receiving hole 136 and the through hole 111 may beformed through punching or laser irradiation or through etching. Here,the light emitting device 20 may include an LED chip having asemiconductor layer and an active layer, and at least one electrode maybe formed on an upper surface of the light emitting device.

The phosphor layer 130 may further include a spacer (not shown). Thespacer may allow for a coating thickness to be maintained at anappropriate level when the phosphor layer 130 is coated on a targetobject, and thus, the spacer may have a size equal to a thickness ofcoating to be performed. An amount of a spacer occupied in the phosphorlayer 130 may be several percent (%) or less thereof. In order toprevent reduction in light properties, the spacer may be formed of aninorganic or an organic material significantly excellent in terms oflight transmissivity. Alternatively, in order to reflect light from aspacer surface, an inorganic or an organic material having a surfacecoated with a reflective layer having relatively high reflectance may beused.

The cover film 150 may be formed of a general polymer material, PVC,polyolefin, PET, PI, or the like, in a similar manner to the base film110. A releasing agent may be coated on a surface on which the phosphorlayer 130 is adhered to the cover film 150, such that the cover film 150is easily separated from the phosphor layer 130. The cover film 150 maybe selectively applied as needed in a process and may not necessarily beapplied thereto.

FIG. 5 illustrates a structure of a phosphor film 200 according toanother embodiment of the present invention. The phosphor film 200according to the embodiment of the present invention may have astructure in which the phosphor layer 130 is cut in advance, based on apredetermined standard. That is, the phosphor layer 130 may include aplurality of phosphor strips 131 having a predetermined size and spacedapart from one another by a predetermined interval. Similarly, therespective phosphor strips 131 forming the phosphor layer 130 may beformed as a single layer or formed of a plurality of layers stackedtherein as shown in FIG. 2. In addition, the cover film 150 may includea plurality of cover film strips 151 having a size corresponding to thatof the phosphor strips 131. The size of the phosphor strips 131 or aninterval therebetween may be determined to be appropriate for a targetobject to be coated with the phosphor strips 131. For example, in thecase of being applied to a substrate on which a plurality of lightemitting devices are arrayed, the size of the phosphor strips 131 or aninterval therebetween may be determined according to the size of thelight emitting device and an interval between the arrayed light emittingdevices. The plurality of phosphor strips 131 may be arrayed in a singledirection in one dimension or in two dimensions. In addition, althoughnot shown in FIG. 5, the receiving holes 136 as in FIG. 3 may berespectively formed in the plurality of phosphor strips 131 tocorrespond to a position of an electrode included in the light emittingdevice.

FIG. 6 illustrates an example in which the phosphor film of FIG. 5 isstored. The phosphor film 200 may be in strip form and be a reel typefilm so as to facilitate the storage thereof. The phosphor film 200 maybe kept in a partially cured state at normal temperature, and at thetime of being used, heat may be applied to necessary numbers of phosphorstrips 131 such that they may be coated on a target object. Although thecase in which the phosphor strips 131 are arrayed on the phosphor film200 in one dimension is illustrated by way of example, the presentinvention is not limited thereto.

FIG. 7 illustrates a structure of a phosphor film 300 according toanother embodiment of the present invention. The phosphor film 300according to the present embodiment may be differentiated from thephosphor film 200 according to the embodiment of FIG. 5, in that in thephosphor film 300 according to the present embodiment, the phosphorlayer 130 includes a plurality of phosphor strips 131 having apredetermined size and spaced apart from one another by a predeterminedinterval, and the cover film 150 is formed of a single film overallcovering the plurality of phosphor strips 131. The phosphor strips 131may be arrayed in one dimension or in two dimensions. The phosphor film300 according to the present embodiment may also be kept in a reel typein the similar manner to FIG. 6, and at the time of being used, thecover film 150 may be separated from the phosphor film 300. Similarly,although not shown in FIG. 7, the plurality of phosphor strips 131 maybe formed of a plurality of layers as shown in FIG. 2, and therespective phosphor strips 131 may respectively have the receiving holes136 as in FIGS. 3 and 4, to correspond to a position of an electrodeincluded in the light emitting device.

FIG. 8 illustrates a structure of a phosphor film 400 according toanother embodiment of the present invention. In the present embodiment,the base film 110, the phosphor layer 130 and the cover film 150 may berespectively formed of a single film. The phosphor film 400 may havestrip form as a reel-type film so as to facilitate the storage thereofas shown in FIG. 6. Similarly, the phosphor layer 130 may be formed of aplurality of layers as shown in FIG. 2, and in the phosphor layer 130,the receiving hole 136 as in FIGS. 3 and 4 may be formed to correspondto a position of an electrode included in each light emitting deviceaccording to a position of an LED chip and an interval between thearrayed LED chips. During use, the cover film 150 may be separated fromthe phosphor layer 130.

FIGS. 9 and 10 schematically illustrate a structure of a phosphor film500 according to another embodiment of the present invention. In thepresent embodiment, the phosphor film may have a form corresponding toan overall form of the wafer W so as to be entirely covered in a waferlevel state, that is, before a plurality of light emitting devices 20grown on the wafer W through a chemical vapor deposition (CVD) device orthe like are divided into individual chips, respectively. In addition, aplurality of receiving holes 136 may be provided to respectivelycorrespond to positions of the electrodes 21 on the respective lightemitting devices 20 according to an interval between a plurality oflight emitting devices 20 arrayed on the wafer. Similarly, the phosphorlayer 130 may be formed of a plurality of layers as shown in FIG. 2, andthe base film 110 may include a through hole 111 to correspond to aposition of the receiving hole 136 formed in the phosphor layer 130. Ina case in which the cover film 150 is provided, the cover film 150 maybe separated from the phosphor layer 130 at the time of being used.

Physical properties of the phosphor layer 130 described with referenceto FIG. 5 and FIGS. 7 to 10 are the same as those described withreference to FIGS. 1 and 2. In addition, although not shown FIG. 5 andFIGS. 7 to 10, a temporary adhesive layer may be selectively, furtherprovided between the phosphor layer 130 and the base film 110. Processesof using the temporary adhesive layer may have a slight differenceaccording to a detailed form of the phosphor films 200, 300, 400 and500.

Hereinafter, a method of manufacturing a phosphor film according to anembodiment of the present invention will be described. Manufacturingmethods to be described below are methods in which a phosphor layerformed of a material obtained by mixing phosphor particles in apartially cured resin material is formed on a base film. A method ofmanufacturing a phosphor film in which a phosphor layer is configured ofa plurality of phosphor strips spaced apart from one another will bedescribed by way of an example.

FIGS. 11 to 15 illustrate a method of manufacturing a phosphor filmaccording to an embodiment of the present invention.

With reference to FIG. 11, the phosphor layer 130 may be formed on thebase film 110. The base film 110 may be formed of an expandable polymermaterial. The phosphor layer 130 may be formed of a material obtained bymixing phosphor particles in a partially cured resin material, may be ina partially cured state at normal temperature and may have a phasechange to be movable upon being heated. The phosphor layer 130 accordingto the present embodiment may have substantially the same structure asthe phosphor layer 130 described with reference to FIGS. 1 and 2.

With reference to FIG. 12, the cover film 150 may be formed on thephosphor layer 130. Here, a temporary adhesive layer (not shown) may beformed on a surface on which the cover film 150 is to be adhered to thephosphor layer 130, and in this case, the cover film 150 may then beadhered to the phosphor layer 130, having the temporary adhesive layertherebetween. Subsequently, the cover film 150 and the phosphor layer130 may be cut, for example, along a plurality of first cutting lines L1provided in line.

Then, with reference to FIG. 13, the cover film 150, the phosphor layer130 and the base film 110 may be cut, for example, along a secondcutting line L2 perpendicular to the first cutting line L1.

FIG. 14 illustrates a strip shape formed through the cutting processdescribed above. Then, the base film 110 may be expanded in both lateraldirections, left and right. Accordingly, the phosphor film 200 may bemanufactured in such a manner that the phosphor layer 130 is dividedinto the plurality of phosphor strips 131 and the cover film 150 isdivided into the plurality of cover film strips 151, as shown in FIG.15. The manufactured phosphor film 200 may be easily kept as a reel-typefilm as shown in FIG. 16.

FIGS. 16 to 22 illustrate a method of manufacturing a phosphor filmaccording to another embodiment of the present invention.

First, as shown in FIG. 16, the phosphor layer 130 may be formed on thebase film 110. The base film 110 may be formed of an expandable polymermaterial. The phosphor layer 130 may be formed of a material obtained bymixing phosphor particles in a partially cured resin material, may be ina partially cured state at normal temperature and may have a phasechange to be movable upon being heated. The phosphor layer 130 accordingto the present embodiment may have substantially the same structure asthe phosphor layer 130 described with reference to FIGS. 1 and 2.

Then, as shown in FIG, 17, the phosphor layer 130 may be cut along thefirst cutting line L1, and as shown in FIG. 18, the base film 110 may beexpanded in both lateral directions, left and right. Therefore, thephosphor layer 130 may be divided into a plurality of regions throughthe first cutting line L1 as shown in FIG. 19.

Subsequently, the cover film 150 may be formed above the phosphor layer130 as shown in FIG. 20. A temporary adhesive layer (not shown) may alsobe further formed on a surface on which the cover film 150 is to beadhered to the phosphor layer 130.

Next, the cover film 150, the phosphor layer 130 and the base film 110may be cut along the second line L2 perpendicular to the first cuttingline L1 as shown in FIG. 21, such that a phosphor film 300 asillustrated in FIG. 22 is manufactured. The manufactured phosphor film300 may be kept as a reel-type film as shown in FIG. 6.

FIGS. 23 to 27 illustrate a method of manufacturing a phosphor filmaccording to another embodiment of the present invention.

With reference to FIG. 23, a mask M having a plurality of holes formedtherein may be disposed above the base film 110. The size of theplurality of holes and an interval therebetween may be determinedaccording to the size of phosphor strips to be manufactured and aninterval therebetween.

Then, as shown in FIG. 24, a paste 130′ obtained by mixing phosphorparticles in a partially cured resin material may be printed using themask M. Thus, the phosphor layer 130 having a structure in which thephosphor strips 131 are disposed on positions corresponding to the holesformed in the mask M may be formed as shown in FIG. 25. FIG. 25illustrates the case in which a single phosphor layer 130 is printed andformed, but the present invention is not limited thereto, and a phosphorlayer having a multilayered structure may be used as shown in FIG. 2.That is, the phosphor layer may be formed by printing a first layer 130a using the mask M and a second layer 130 b may then be printed on thefirst layer 130 a.

Then, the structure of FIG. 25 may be cut in strip form as shown in FIG.26, and the cover film 150 may be formed on the cut phosphor layer 130as shown in FIG. 27. The manufactured phosphor film may be kept as areel-type film as shown in FIG. 6.

FIGS. 28A and 28B illustrate a method of manufacturing a phosphor filmaccording to another embodiment of the present invention. FIG. 28Aillustrates a structure as illustrated in FIG. 25, and as shown in FIG.28B, the cover film 150 may be formed on the phosphor layer 130. Aphosphor film 600 as illustrated in FIG. 28B may have a form appropriatefor simultaneously coating a plurality of LED chips with the phosphorlayer 130. The number of the phosphor strips 131 or disposition thereofmay be appropriately determined according to the disposition of aplurality of LED chips to be coated with the phosphor layer 130.

Hereinafter, a method of coating a light emitting device with a phosphormaterial will be described. Embodiments of the present invention to bedescribed below commonly include processes in which a phosphor filmincluding a phosphor layer formed by mixing phosphor particles in apartially cured resin material is prepared, heat is applied to thephosphor layer to generate mobility therein, and the phosphor layerhaving the generated mobility is pressed and adhered to the vicinity ofthe light emitting device, by way of examples.

FIGS. 29 to 32 illustrate a method of coating a light emitting devicewith a phosphor layer according to an embodiment of the presentinvention. The present embodiment provides a pickup and pressing method,a coating method using the phosphor film 200 manufactured as illustratedin FIG. 15.

First, FIG. 29 is a schematic view illustrating a supplier reel RE1supplying the phosphor film 200, a pickup head H and a pushpin PPlifting the phosphor strips 131 and the cover film strips 151 from thebase film 110, and a collector reel RE2 collecting the base film 110. Ina case in which a temporary adhesive layer (not shown) is formed betweenthe base film 110 and the phosphor strips 131, ultraviolet (UV) lightmay be emitted before the pickup operation in order to reduce adhesion.

FIG. 30 illustrates a pickup operation. The pushpin PP and the pickuphead H may be disposed to have the phosphor film 200 interposedtherebetween. The pushpin PP serves to press the base film upwardly. Thepickup head H may include a collet C contacting a target object. Asurface of the collet C may be provided with a plurality of microconduits (not shown), such that a target object may be temporarilycaptured in a pressure reduced state through vacuum conduits (not shown)formed in the pickup head H. The collet C may be formed of rubber, ametal, a heat resistant engineering plastic material, or the like.

FIG. 31 illustrates an operation of pressing and adhering the liftedphosphor strips 131 to the vicinity of the light emitting device 20. Inorder to apply heat to the phosphor strips 131, a substrate 10 to whichan LED chip 20 is wire-bonded may be disposed on a heating stage S. Asthe cover film strip 151 and the phosphor strip 131 are closer to thelight emitting device 20, the phosphor strip 131 may have mobility dueto heat, and the phosphor strip 131 may then penetrate the lightemitting device 20 and a wire such that it coats the vicinity of thelight emitting device 20 as shown in FIG. 32.

FIGS. 33A and 33B illustrate a structure of the collet C mounted on thepickup head H used in the embodiment of FIGS. 29 to 32 by way ofexample. Although FIG. 29 illustrates the case in which the collet C isused as a flat type collet, a cavity type collet may be employed asshown in FIGS. 33A and 33B. Such a cavity type collet may serve as aframe allowing a uniform form to be maintained when the cover film strip151 and the phosphor strip 131 are lifted thereby. A depth of the cavitymay be deeper than a thickness of the cover film strip 151 but smallerthan the sum of thicknesses of the cover film strip 151 and the phosphorstrip 131. An inclination of an inner wall of the cavity may be at aright angle, as shown in FIG. 33A, or at an obtuse angle, as shown inFIG. 33B.

FIG. 34 illustrates a method of coating a light emitting device with aphosphor layer according to another embodiment of the present invention.The present embodiment provides a direct pressing method, a coatingmethod using the phosphor film 300 having a form as illustrated in FIG.22. The phosphor film 300 may be provided from the supplier reel RE1,and here, the cover film 150 may be separated, prior to the supply ofthe phosphor film 300 from the supplier reel RE1. The phosphor film 300provided from the supplier reel RE1 may be disposed such that thephosphor strips 131 face the light emitting devices 20. The substrate 10to which the light emitting devices 20 are wire-bonded may be disposedon the heating stage S, and pressure may be applied to a surfacedifferent from a surface of the base film 110 on which the phosphorstrips 131 are disposed. As the phosphor strip 131 is closer to thelight emitting device 20, the phosphor strip 131 may have mobilitygenerated therein due to heat, and the phosphor strip 131 may thenpenetrate the light emitting device 20 and the wire such that it coatsthe vicinity of the light emitting device 20. A portion of the base film110 from which the phosphor strip 131 has been removed may be collectedby the collector reel RE2.

FIGS. 35A and 35B illustrate a method of coating a light emitting devicewith a phosphor layer according to another embodiment of the presentinvention. The present embodiment provides a direct pressing method andmay be differentiated from the method according to the embodimentdescribed with reference to FIG. 34 in that in the present embodiment, aplurality of phosphor strips 131 are simultaneously coated on aplurality of light emitting devices 20. The phosphor film 300 may beprovided and collected in the forms as illustrated in FIG. 34.Alternatively, the phosphor film may be used after removing the coverfilm 150 from the phosphor film 600 as illustrated in FIG. 28B, preparedto be appropriate for a disposed form of the light emitting devices 20.

FIGS. 36A and 36B illustrate a method of coating a light emitting devicewith a phosphor layer according to another embodiment of the presentinvention. The present embodiment provides a roll and pressing method,in which pressure is sequentially applied to the other surface of thebase film 110 by using a roller RL, whereby the plurality of lightemitting devices 20 may be coated in order.

FIGS. 37A, 37B and 37C illustrate a method of coating a light emittingdevice with a phosphor layer according to another embodiment of thepresent invention. The present embodiment provides a roll and pressingmethod, in which the phosphor layer 130 is not divided into phosphorstrips in advance. The phosphor film may be used after removing thecover film 150 from the phosphor film 400 prepared to have the form asillustrated in FIG. 8. The phosphor layer 130 may be coated in such amanner that it surrounds the plurality of entire light emitting devices20 and may then be cut into individual LED chip units 20. In the presentembodiment, the vicinity of the plurality of light emitting devices 20may be coated once by the direct pressing method.

In the coating methods using the phosphor layer described above, thelight emitting devices configured to have a wire-bonded form to asubstrate is illustrated by way of examples, but the present inventionis not limited thereto and is applicable to all types of light emittingdevices such as pre-mold type and printed circuit board (PCB)-appliedarray type light emitting devices, light emitting devices having aflip-chip structure, and the like.

Meanwhile, the coating method using the phosphor layer described above,in which a resin material forming the phosphor layer is manufactured tohave a film form having a partially cured state and then to be reheatedto then perform the coating, is provided by way of examples, but thepresent invention is not limited thereto. That is, the coating may alsobe performed using a dispensing method in which a resin material mixedwith phosphor particles having the same physical properties as thephosphor layer of FIG. 1 is dispensed and then re-heated such that thevicinity of the light emitting devices 20 is coated.

Hereinafter, a method of manufacturing a light emitting device packageand a light emitting device package manufactured thereby will bedescribed.

FIGS. 38A and 38B schematically illustrate a method of manufacturing alight emitting device package and a light emitting device packagemanufactured thereby. The present embodiment provides the method ofcoating a surface of a light emitting device with a phosphor layer byusing the phosphor film 200 manufactured as illustrated in FIG. 15, buta phosphor film used in the present invention is not limited thereto.Here, the light emitting device 20 may include an LED chip having asemiconductor layer and an active layer and may be provided as a singlelight emitting device or a plurality of light emitting devices. Thelight emitting device may be mounted on a main body part including alead frame (not shown) to be electrically connected to the lead frame.

The present embodiment may be characterized in that heat is applied tothe phosphor strip 131 to have mobility generated thereby, instead ofpressing and adhering the lifted phosphor strip 131 to the vicinity ofthe light emitting device 20, and the phosphor strip 131 having themobility generated due to heat may flow toward a surface of thewire-bonded light emitting device 20 due to their own weight, such thatthe surface of the light emitting device 20 is coated.

In detail, as shown in FIG. 15, the phosphor film 200 including the basefilm 110 and the phosphor layer 130 formed of a material obtained bymixing phosphor particles in a partially cured resin material and formedon the base film 110 may be first prepared. The phosphor layer 130 maybe divided into a plurality of phosphor strips 131, and since physicalproperties of the phosphor layer 130 are the same as those describedwith reference to FIGS. 1 and 2, a description thereof is omitted.

FIG. 38A schematically illustrates coating operations. Respectivephosphor strips 131 and cover film strips 151 lifted by the pickup headH may be disposed on the light emitting devices 20 such that thephosphor strips 131 face the light emitting devices 20. The phosphorstrips 131 may be directly heated by the pickup head H or indirectlyheated through the heating stage S including the main body part 2disposed thereon having the light emitting device 20 mounted therein,such that the phosphor strips 131 have mobility generated thereby. Thephosphor strips 131 having the generated mobility may be separated fromthe cover film strips 151 to flow toward to the light emitting devices20 due to their own weight, such that they may be coated on the lightemitting devices 20 including the wire. Therefore, as shown in FIG. 38B,the phosphor layer 130 formed on the light emitting device 20 by usingthe phosphor strip 131 may be coated along a shape of the wire to have aform corresponding to the shape of the wire. In addition, the phosphorlayer 130 may be coated on sides of the light emitting device 20 in sucha manner as integrally coating the active layer. In the case of thelight emitting device package 1 shown in FIG. 38B, the case in which twoelectrodes are formed on an upper surface of the light emitting device20 to be thus electrically connected to two wires is provided, but thenumber of the electrodes and the wires may be variable. In addition, thelight emitting device package may further include an encapsulating part(not shown) provided with the main body part 2, encapsulating the lightemitting device 20 to protect the light emitting device 20.

In the present embodiment, reliability may be enhanced, in that sincethe wire-bonded light emitting device does not have physical forceexerted thereupon, a possibility in which transformation may occur in awire may be fundamentally prevented. In addition, since the phosphorlayer is formed to integrally coat an upper surface of the lightemitting device and the sides thereof, including the active layer, alight leakage phenomenon may be prevented and thus, light extractionefficiency may be improved. Further, since the phosphor layer ismanufactured to have a film form having a uniform thickness and is usedfor the coating process, an overall thickness deviation may be reducedand thus, color dispersion between products may be reduced.

On the other hand, the present embodiment describes the case in which alight emitting device is coated in a state in which mobility has beengenerated by heating phosphor strips having a B-stage cured state, butthe present invention is not limited thereto. That is, instead offorming a resin material mixed with phosphor particles having the samephysical properties as the phosphor strips to have phosphor stripshaving a B-stage cured state of a film form, a method of coating thevicinity of the light emitting device 20 by dispensing using a dispenseror the like and then re-heating may be used.

FIGS. 39 to 43 and FIG. 44 schematically illustrate a method ofmanufacturing a light emitting device package according to anotherembodiment of the present invention, and a light emitting device packagemanufactured thereby. The present embodiment may be differentiated fromthe method and structure of FIGS. 38A and 38B in that the coating isperformed except for the electrode provided on the upper surface of thelight emitting device and the wire connected thereto. In addition, thepresent embodiment describes the case in which the coating issimultaneously performed on the plurality of light emitting devices, butthe present invention is not limited thereto.

First, the phosphor film 500 may be prepared to have the form asillustrated in FIGS. 9 and 10 and may be used by separating the coverfilm 150 therefrom. FIG. 39 schematically illustrates an array structureof the light emitting devices 20 to be coated with the phosphor film. Asshown in FIG. 39, the light emitting devices 20 may be prepared to havea wafer level state in which a plurality of light emitting devices 20are arrayed on the wafer W to be divided into individual chips, that is,before being divided. The light emitting device 20 may include an LEDchip having a semiconductor layer and an active layer, and may be avertical type light emitting device in which the electrodes 21 areformed on upper and lower surfaces thereof or a plurality of electrodes21 are formed on an upper surface thereof.

FIG. 40 illustrates a receiving hole patterning operation using molding,punching, laser irradiation, etching, or the like, in which a pluralityof receiving holes 136 are formed in the phosphor film 500 torespectively correspond to positions of the electrodes 21 formed on thelight emitting devices 20 according to an interval between the lightemitting devices 20 arrayed on the wafer W. Here, the base film 110 mayinclude through holes 111 corresponding to positions of the receivingholes 136.

FIG. 41 illustrates an operation in which the phosphor film 500 isadhered to an upper surface of the light emitting device 20. Thephosphor film may be adhered to the upper surface of the light emittingdevice 20 such that the electrodes 21 of the light emitting devicesrespectively coincide with the receiving holes 136. Therefore, theelectrodes 21 of the light emitting devices may be respectively exposedthrough corresponding receiving holes 136. In addition, as shown in FIG.42, after the base film 110 is removed, heat may be applied to thephosphor layer 130 to provide mobility therein. The phosphor layer 130having the generated mobility may flow toward the vicinity of the lightemitting device 20 except for the electrode 21, such that at leastportions of the upper surface and sides of the light emitting device 20may be coated therewith.

As such, the phosphor layer 130 may be simultaneously coated on theplurality of light emitting devices 20, and then, a dicing process maybe performed to obtain individual light emitting devices 20 coated withthe phosphor layer 130 by being cut thereinto.

FIG. 44 illustrates a light emitting device package having the lightemitting devices 20 mounted therein. Each of the light emitting devices20 separated with reference to FIG. 43 may be mounted on a lead frame 3of the main body part 2, and the electrode 21 not coated with thephosphor layer 130 may be electrically connected to the lead frame 3through a wire 4. In addition, the light emitting device 20 and the wire4 may be manufactured as a light emitting device package 1′ through apackaging process of encapsulating the light emitting device 20 and thewire 4 by an encapsulating part 5.

While the present invention has been shown and described in connectionwith the embodiments thereof, it will be apparent to those skilled inthe art that modifications and variations can be made without departingfrom the spirit and scope of the invention as defined by the appendedclaims.

1. A phosphor film comprising: a base film; a phosphor layer formed onthe base film and obtained by mixing phosphor particles in a partiallycured resin material; and a cover film formed on the phosphor layer toprotect the phosphor layer.
 2. The phosphor film of claim 1, wherein thephosphor layer is in a partially cured state at normal temperature andhas a phase change to be movable upon being heated. 3-4. (canceled) 5.The phosphor film of claim 1, wherein the phosphor layer has a structurein which at least one or more layers are stacked.
 6. The phosphor filmof claim 5, wherein the phosphor layer includes a first layer formed onthe base film and a second layer formed on the first layer, and resinmaterials respectively forming the first and second layers havedifferent properties.
 7. The phosphor film of claim 6, wherein the resinmaterial forming the first layer has greater strength than the resinmaterial forming the second layer, and the resin material forming thesecond layer has higher adhesive force than the resin material formingthe first layer. 8-11. (canceled)
 12. The phosphor film of claim 1,wherein the phosphor layer is configured of a plurality of phosphorstrips spaced apart from one another by a predetermined interval. 13.The phosphor film of claim 12, wherein the cover film is formed of aplurality of cover film strips having a size corresponding to that ofthe plurality of phosphor strips. 14-15. (canceled)
 16. A method ofmanufacturing a phosphor film comprising: preparing a base film; andforming a phosphor layer on the base film, the phosphor layer beingformed of a material obtained by mixing phosphor particles in apartially cured resin material and configured of a plurality of phosphorstrips spaced apart from one another by a predetermined interval. 17.The method of claim 16, wherein the forming of the phosphor layerincludes: forming a thin film on the base film, the thin film beingobtained by mixing the phosphor particles in the partially cured resinmaterial; forming a cover film on the thin film; forming a cutting linealong which the thin film and the cover film are cut into strips havinga predetermined size; and expanding the base film such that the thinfilm and the cover film are separated along the cutting line.
 18. Themethod of claim 17, wherein the forming of the cutting line includesforming a plurality of first cutting lines on the thin film and thecover film to be in line in a single direction; and cutting the thinfilm, the cover film and the base film along a second cutting lineperpendicular to the first cutting line to have a strip form.
 19. Themethod of claim 16, wherein the forming of the phosphor layer includes:forming the thin film on the base film, the thin film being obtained bymixing the phosphor particles in the partially cured resin material;forming a plurality of the first cutting lines on the thin film to be inline in a single direction; expanding the base film such that the thinfilm is divided into a plurality of regions along the first cuttingline; forming the cover film on the thin film; and cutting the coverfilm, the thin film and the base film along the second cutting lineperpendicular to the first cutting line to have a strip form.
 20. Themethod of claim 16, wherein the forming of the phosphor layer includes:disposing a mask on the base film, the mask including a plurality ofholes having a size corresponding to that of the plurality of phosphorstrips; forming the thin film by printing the material obtained bymixing the phosphor particles in the partially cured resin material onthe base film, by using the mask; and forming the cover film on the thinfilm.
 21. (canceled)
 22. The method of claim 21, wherein the thin filmincludes a first layer formed on the base film and a second layer formedon the first layer, and resin materials respectively forming the firstand second layers have different properties.
 23. The method of claim 22,wherein the resin material forming the first layer has greater strengththan the resin material forming the second layer, and the resin materialforming the second layer has higher adhesive force than the resinmaterial forming the first layer.
 24. (canceled)
 25. The method of claim20, further comprising cutting the base film to have the strip form.26-66. (canceled)